New X4-Class device delivers 480 A capability in a compact SMPD-X package to streamline thermal design and reduce component count in industrial and energy applications.
A new collaborative lab combines GD32 MCU expertise with Gallium Nitride technology to push the boundaries of power density in AI data centers and renewable energy.
The new M-PCIe specification integrates PCIe protocols with MIPI M-PHY technology to provide a low-power, scalable solution for smartphones, tablets, and ultra-thin laptops.