Infineon and Flex debut a scalable ZCU platform featuring 30 unique building blocks to accelerate automotive E/E architecture transitions.
New 5 nm super-integration processors enable OEMs to consolidate propulsion, safety, and body domains into a single hub, reducing architecture complexity and costs.
Axiomtek introduces a medical-grade computing system featuring 13th Gen Intel Core processing and dedicated GPU expansion for real-time imaging and surgical monitoring.
New R-Car X5H silicon samples and a production-grade development platform aim to unify ADAS, infotainment, and gateway functions on a single 3nm automotive compute engine.
The new Helium family leverages silicon photonics to provide high-resolution depth and velocity sensing in an ultra-compact, software-defined package for autonomous systems.
STMicroelectronics introduces a patented hybrid mode to streamline software development for advanced USB-C sink applications.
New hardware architecture delivers up to 180 platform TOPS and extended temperature support for mission-critical robotics and industrial automation.
New IP cores and hardware bridging kits aim to streamline high-bandwidth video pipelines for medical, industrial, and robotic vision applications.
A new series of Type 6 Compact modules delivers up to 59 TOPS of AI performance for mission-critical edge applications in harsh industrial environments.
New AIOS platform integrates system-level artificial intelligence to bridge the gap between digital models and physical hardware execution.
New SmartMotion IMUs offload computational tasks from the central processor to the sensor, enabling high-fidelity spatial audio and AR overlays with ultra-low power consumption.
Greenliant’s NVMe NANDrive EX Series targets aerospace and industrial applications with ultra-high endurance and advanced security features.
What ATCA Is and Why It Exists AdvancedTCA (ATCA) is an open, PICMG-defined modular platform for building high-availability, high-throughput systems...
This guide explores the technical nuances of carrier board design, from signal integrity and power sequencing to the mechanical and thermal constraints that define a production-ready platform.
Machine-to-machine (M2M) communication in industrial and embedded environments demands a level of predictability that standard consumer Wi-Fi simply cannot provide....
A technical overview of The MIPI Alliance "Improved Inter-Integrated Circuit," or I3C, which represents a significant evolution in two-wire, multi-drop bus technology.
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