PCI-SIG and MIPI Alliance Bridge Standards to Deliver High-Performance I/O for Mobile Devices

The new M-PCIe specification integrates PCIe protocols with MIPI M-PHY technology to provide a low-power, scalable solution for smartphones, tablets, and ultra-thin laptops. By Embedded Systems Engineering / 26 Feb 2013
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PCI-SIG and the MIPI Alliance have commenced procedural reviews for the Mobile PCI Express (M-PCIe) specification. This collaboration is designed to enable PCI Express (PCIe) architecture to operate over MIPI M-PHY physical layer technology. By adapting the PCIe I/O standard for the M-PHY layer, the organizations aim to bring high-performance computing capabilities to mobile platforms, including smartphones, tablets, and thin laptops.

The M-PCIe specification serves as an Engineering Change Notice to the PCIe 3.0 Base specification. By utilizing a layered architecture, the standard integrates the protocol stack of PCIe with the power-efficient characteristics of MIPI’s physical layer. This combination provides the mobile industry with a scalable and interoperable I/O solution intended to maintain a consistent user experience across diverse hardware categories.

Initial applications for the technology are expected to focus on high-performance wireless communications, with broader implementations anticipated across the handheld device market and other ultra-low-power applications. To access licensing rights and future specification evolutions, implementers must maintain memberships in both the PCI-SIG and the MIPI Alliance.

“M-PCIe brings the necessary architecture to support advancement in tablets and smartphones as they take on the role of primary computing devices,” said Al Yanes, Chairman and President, PCI-SIG. “The Mobile market is rapidly evolving and so are consumer expectations, placing an emphasis on low-power with increased performance for a better user experience.”

“M-PCIe offers developers power-efficiency with high scalability using the PCIe protocol,” said Brian O’Rourke, Senior Principal Analyst, IHS. “The implementation of M-PCIe will provide the Mobile industry with truly scalable PCIe solutions to meet consumer demand for next generation mobile devices.”

“The M-PCIe specification provides the Mobile industry with decades of innovation in PCIe technology coupled with the proven M-PHY physical layer that meets low-power requirements needed for today’s mobile device platforms,” said Joel Huloux, Chairman of the Board, MIPI Alliance. “Device manufacturers can drastically reduce the time for product development and validation, and MIPI Alliance is pleased to deliver this specification in partnership with PCI-SIG.”

The specification is scheduled to be available to PCI-SIG members in early Q2 via the organization’s website.

Posted by Embedded Systems Engineering Connect

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