MIPI Alliance Advances High-Resolution Display and Camera Standards for 4K Integration

Updated interface specifications and physical layer protocols set the stage for next-generation UHD mobile displays and high-performance imaging. By Embedded Systems Engineering / 27 Feb 2014
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The MIPI Alliance has announced the advancement of several interface specifications designed to facilitate the adoption of 4K Ultra High Definition (UHD) and high-performance camera technology across the mobile and mobile-influenced sectors. These updates address the increasing complexity of hardware designs while meeting consumer demand for higher screen clarity and faster imaging capabilities.

Central to these developments are upgrades to the MIPI physical layer specifications. The new version of D-PHY features expanded lanes and increased bandwidth, capable of providing over 20Gbps of performance. Simultaneously, the M-PHY specification continues its performance trajectory; Gear 3, offering 5.8Gbps per lane, is currently available, while Gear 4 is expected to reach 11.6Gbps per lane later this year.

When utilized alongside the latest Camera Serial Interface (CSI) and Display Serial Interface (DSI) specifications, and integrated with VESA compression technology, these physical layers support higher speeds and expanded feature sets. These protocols are essential for managing the data throughput required for 2K and 4K mobile displays and sophisticated camera modules.

“The industry is very optimistic about 2K and 4K displays and their market potential. MIPI Alliance members are helping to accelerate the adoption of the technology by providing a consistent interface protocol for manufacturers and designers to follow,” said Joel Huloux, chairman of the board, MIPI Alliance. “Consumers want stunning screen clarity and detail in their TVs and mobile devices. They also want their cameras to have the ability to take better pictures, faster. Our protocols and specifications are enabling these technological advances by strategically solving problems as devices become more complex.”

Beyond internal display and camera connections, these additions benefit MIPI Alliance partners by accelerating related standards. This includes support for SSIC from USB-IF, M-PCIe from PCI-SIG, and UFS V2.0 for UHD from JEDEC, the latter of which operates in conjunction with the MIPI UniPort-M.

Posted by Embedded Systems Engineering Connect

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