Littelfuse Increases Power Density with High-Current 200 V Ultra-Junction MOSFET

New X4-Class device delivers 480 A capability in a compact SMPD-X package to streamline thermal design and reduce component count in industrial and energy applications. By Embedded Systems Engineering / 27 Nov 2025
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Littelfuse has expanded its X4-Class portfolio with the introduction of the MMIX1T500N20X4 X4-Class Ultra-Junction Power MOSFET. This 200 V, 480 A N-channel device is engineered to address the requirements of power-dense designs by offering an exceptionally low on-state resistance (RDS(on)) of 1.99 mΩ. The combination of high current capacity and low resistance is intended to improve conduction efficiency and simplify thermal management across a variety of demanding sectors.

The device is housed in a ceramic-based, isolated SMPD-X package featuring topside cooling. This packaging choice provides 2500 V isolation and a thermal resistance (Rth(j-c)) of 0.14 °C/W. When compared to existing X4-Class MOSFET solutions, the MMIX1T500N20X4 provides up to double the current rating and a reduction in RDS(on) by as much as 63%. These specifications allow engineering teams to consolidate designs by replacing multiple paralleled low-current components with a single high-current solution, effectively reducing the overall part count and required PCB area.

In addition to its thermal and current specifications, the MOSFET features a low gate charge (Qg) of 535 nC, which helps to minimize gate drive power requirements. The integration of these features supports higher power density and simplified assembly, leading to more cost-effective system architectures.

The technical profile of the MMIX1T500N20X4 makes it suitable for several high-current, low- to moderate-voltage applications. These include DC load switches, battery energy storage systems, and industrial charging infrastructure. It is also designed for use in industrial and process power supplies, as well as aerospace applications such as drones and vertical take-off and landing (VTOL) platforms.

“The new devices enable designers to consolidate multiple paralleled low-current devices into a single high-current device, simplifying the design and reducing component count,” said Antonio Quijano, Product Marketing Analyst at Littelfuse. “This enhances system reliability, streamlines gate driver implementation, and increases both power density and PCB area efficiency.”

The MMIX1T500N20X4 is available in tube or tape-and-reel formats through authorized distributors.

Posted by Embedded Systems Engineering Connect

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