GigaDevice has expanded its dual-voltage Flash portfolio with the launch of the GD25NX series, a new generation of high-performance xSPI NOR Flash. Designed with a 1.8 V core and a 1.2 V I/O, these products are engineered to interface directly with 1.2 V systems on chips (SoCs). This architectural choice eliminates the need for external booster circuits, providing a pathway for designers to reduce both overall system power consumption and Bill of Materials (BOM) costs.
The series is built to meet the rigorous stability and responsiveness requirements of modern embedded applications, including wearables, data centers, edge AI, and automotive electronics. The GD25NX supports an octal SPI interface with a maximum clock frequency of 200 MHz. In both single transfer rate (STR) and double transfer rate (DTR) modes, the hardware can achieve data throughput of up to 400 MB/s. Performance improvements are also noted in memory management tasks, with a typical page program time of 0.12 ms and a sector erase time of 27 ms—representing a 30% increase in programming speed compared to conventional 1.8 V octal Flash products.
Efficiency is a primary focus of the new 1.2 V I/O architecture. When operating at 200 MHz, the devices maintain read currents as low as 16 mA in Octal I/O STR mode and 24 mA in Octal I/O DTR mode. This design results in a reduction of read power consumption by up to 50% when measured against standard 1.8 V Octal I/O SPI NOR Flash devices, making it a viable solution for power-sensitive high-speed operations.
To ensure data integrity in demanding environments, the GD25NX series incorporates error correction code (ECC) algorithms and cyclic redundancy check (CRC) verification. These features work alongside a data strobe (DQS) functionality that maintains signal integrity during high-speed transfers, a critical requirement for SoCs used in automotive and data center sectors.
“The GD25NX series sets a new benchmark for combining low voltage with high performance in SPI NOR Flash,” stated by Ruwei Su, GigaDevice Vice President and General Manager of Flash BU. “Its design aligns closely with mainstream SoC requirements for low-voltage interfaces, enabling higher integration and lower BOM costs for customers. Moving forward, GigaDevice will continue to expand its dual-voltage portfolio with broader density and package options to help customers build the next generation of efficient and reliable low-power storage solutions.”
The series is currently offered in 64 Mb and 128 Mb densities and is available in TFBGA24 and WLCSP packages. GigaDevice has begun providing samples of the 128 Mb GD25NX128J for evaluation, with the 64 Mb variant currently in preparation.
