ADLINK Technology has introduced its Express-PTL COM modules, marking a significant hardware update utilizing the new Intel Core Ultra Series 3 processors. The modules are designed to handle complex edge AI workloads by leveraging a triple-engine architecture that combines a Central Processing Unit (CPU), a Neural Processing Unit (NPU), and an integrated Graphics Processing Unit (GPU).
The system architecture features the NPU 5.0, which provides up to 50 TOPS of dedicated AI acceleration. This is complemented by an integrated Intel Arc GPU featuring up to 12 Xe cores, capable of delivering 120 TOPS for AI tasks alongside enhanced graphics rendering. In total, the platform provides up to 180 TOPS of AI compute. The computing core uses a hybrid CPU architecture consisting of four high-performance cores, eight efficiency cores, and four low-power efficiency cores to balance processing power with energy consumption.
To support high-bandwidth data requirements, the module accommodates up to 128GB of DDR5 SO-DIMM memory with In-Band Error Correction Code (IBECC). The design includes a higher bandwidth PCIe interface to facilitate low-latency interaction between the processor and external accelerators, a critical requirement for real-time decision-making in autonomous robotics, including humanoid and quadruped platforms.
For deployment in harsh environments, ADLINK is offering industrial-temperature SKUs. These versions are engineered to operate in temperatures ranging from –40°C to 85°C. The modules also incorporate features for mission-critical reliability, including Time Coordinated Computing (TCC), Time-Sensitive Networking (TSN), and compliance with Functional Safety (FuSa) standards.
Looking ahead to the second quarter of 2026, the product line will expand to include the COM-HPC-mPTL. This compact 95 mm x 70 mm module will feature soldered-down memory to ensure operational stability under high levels of vibration and shock. Additionally, the SBC35-PTL, a 3.5-inch single-board computer, and the MXE-330 edge computing platform are scheduled for release in the third quarter of 2026. These upcoming releases will feature an Adaptive Function Module (AFM) design, which allows for customizable I/O configurations to meet specific application connectivity needs.
Development kits for the Express-PTL and COM-HPC-mPTL, including reference carriers and full I/O support, are expected to be available in Q2 2026 to assist with prototyping and system integration.
