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Infineon and Flex debut a scalable ZCU platform featuring 30 unique building blocks to accelerate automotive E/E architecture transitions.

New SmartMotion IMUs offload computational tasks from the central processor to the sensor, enabling high-fidelity spatial audio and AR overlays with ultra-low power consumption.

New 5 nm super-integration processors enable OEMs to consolidate propulsion, safety, and body domains into a single hub, reducing architecture complexity and costs.

Greenliant’s NVMe NANDrive EX Series targets aerospace and industrial applications with ultra-high endurance and advanced security features.

Axiomtek introduces a medical-grade computing system featuring 13th Gen Intel Core processing and dedicated GPU expansion for real-time imaging and surgical monitoring.

New high-performance computing platforms leverage AURIX microcontrollers to scale AI integration from partial to high automation levels.

New R-Car X5H silicon samples and a production-grade development platform aim to unify ADAS, infotainment, and gateway functions on a single 3nm automotive compute engine.

New VL122 and VL123 controllers offer extended temperature support and enhanced signal integrity for demanding embedded and industrial environments.

New high-bandwidth chiplet interconnect reaches 64G speeds to meet the escalating performance and power demands of AI and data center architectures.

New M.2 module integrates advanced NPU technology to deliver 25 TOPS for vision-centric defense and industrial applications.

Total contract ceiling increases to $88 million as QuickLogic achieves key milestone with test chip tape-out for mission-critical defense and space systems.

New Qualcomm-based modular architecture offers pin-to-pin upgradability and a decade of lifecycle support for AI-driven defense and industrial applications.

The new Helium family leverages silicon photonics to provide high-resolution depth and velocity sensing in an ultra-compact, software-defined package for autonomous systems.

IAR and SiFive deepen their collaboration to provide certified development tools for the latest 32-bit and 64-bit automotive-grade RISC-V processor cores.

Successful testing enables the use of cost-effective, high-bandwidth HYPERRAM with the AMD MicroBlaze V processor for embedded AI and I/O expansion applications.

The update introduces solutions for real-time human fall detection, energy-efficient object recognition, and automated land-cover change analysis across diverse embedded platforms.

EMASS's ECS-DoT AI chips integrate with Semtech's LoRa transceivers to provide long-range, battery-efficient intelligence for IoT systems requiring on-device data processing.

Joint research demonstrates a path toward high-performance, cost-effective, and fully integrated radio frequency and optical front-end modules using layered silicon technologies.