The new Helium family leverages silicon photonics to provide high-resolution depth and velocity sensing in an ultra-compact, software-defined package for autonomous systems.
New AIOS platform integrates system-level artificial intelligence to bridge the gap between digital models and physical hardware execution.
Infineon and Flex debut a scalable ZCU platform featuring 30 unique building blocks to accelerate automotive E/E architecture transitions.
New SmartMotion IMUs offload computational tasks from the central processor to the sensor, enabling high-fidelity spatial audio and AR overlays with ultra-low power consumption.
New 5 nm super-integration processors enable OEMs to consolidate propulsion, safety, and body domains into a single hub, reducing architecture complexity and costs.
Greenliant’s NVMe NANDrive EX Series targets aerospace and industrial applications with ultra-high endurance and advanced security features.
Axiomtek introduces a medical-grade computing system featuring 13th Gen Intel Core processing and dedicated GPU expansion for real-time imaging and surgical monitoring.
New high-performance computing platforms leverage AURIX microcontrollers to scale AI integration from partial to high automation levels.
New R-Car X5H silicon samples and a production-grade development platform aim to unify ADAS, infotainment, and gateway functions on a single 3nm automotive compute engine.
New VL122 and VL123 controllers offer extended temperature support and enhanced signal integrity for demanding embedded and industrial environments.
New high-bandwidth chiplet interconnect reaches 64G speeds to meet the escalating performance and power demands of AI and data center architectures.
What ATCA Is and Why It Exists AdvancedTCA (ATCA) is an open, PICMG-defined modular platform for building high-availability, high-throughput systems...
This guide explores the technical nuances of carrier board design, from signal integrity and power sequencing to the mechanical and thermal constraints that define a production-ready platform.
Machine-to-machine (M2M) communication in industrial and embedded environments demands a level of predictability that standard consumer Wi-Fi simply cannot provide....
A technical overview of The MIPI Alliance "Improved Inter-Integrated Circuit," or I3C, which represents a significant evolution in two-wire, multi-drop bus technology.
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The new M-PCIe specification integrates PCIe protocols with MIPI M-PHY technology to provide a low-power, scalable solution for smartphones, tablets, and ultra-thin laptops.
New lightweight database management system offers ACID compliance and high-performance SQL access for embedded developers on Windows and Linux.
A new diagnostic tool for Android and BlackBerry devices utilizes patent-pending technology to alert users when SAR levels peak during operation.
The unified organization aims to streamline the development of language-based and IP reuse standards for the global electronic design community.
MontaVista enables developers to jump-start application design on simulated multicore silicon months before hardware availability.