Hardware & Components News & Articles

New hardware architecture delivers up to 180 platform TOPS and extended temperature support for mission-critical robotics and industrial automation.

New IP cores and hardware bridging kits aim to streamline high-bandwidth video pipelines for medical, industrial, and robotic vision applications.

A new series of Type 6 Compact modules delivers up to 59 TOPS of AI performance for mission-critical edge applications in harsh industrial environments.

New AIOS platform integrates system-level artificial intelligence to bridge the gap between digital models and physical hardware execution.

Infineon and Flex debut a scalable ZCU platform featuring 30 unique building blocks to accelerate automotive E/E architecture transitions.

New SmartMotion IMUs offload computational tasks from the central processor to the sensor, enabling high-fidelity spatial audio and AR overlays with ultra-low power consumption.

New 5 nm super-integration processors enable OEMs to consolidate propulsion, safety, and body domains into a single hub, reducing architecture complexity and costs.

Greenliant’s NVMe NANDrive EX Series targets aerospace and industrial applications with ultra-high endurance and advanced security features.

Axiomtek introduces a medical-grade computing system featuring 13th Gen Intel Core processing and dedicated GPU expansion for real-time imaging and surgical monitoring.

New high-performance computing platforms leverage AURIX microcontrollers to scale AI integration from partial to high automation levels.

New R-Car X5H silicon samples and a production-grade development platform aim to unify ADAS, infotainment, and gateway functions on a single 3nm automotive compute engine.

New VL122 and VL123 controllers offer extended temperature support and enhanced signal integrity for demanding embedded and industrial environments.

New high-bandwidth chiplet interconnect reaches 64G speeds to meet the escalating performance and power demands of AI and data center architectures.

The new GD25NX series leverages a 1.2 V I/O architecture to slash read power consumption by half while delivering data throughput of up to 400 MB/s.

A new partnership brings KontronOS to congatec’s aReady.COM portfolio, offering developers a hardened, Linux-based foundation for cyber-resilient embedded systems.

New X4-Class device delivers 480 A capability in a compact SMPD-X package to streamline thermal design and reduce component count in industrial and energy applications.

New secure NFC tag enables seamless "tap-to-pair" device commissioning and battery-less setup for the latest Matter 1.5 standard.

A new strategic collaboration focuses on co-designing high-performance data center hardware and domestic manufacturing to secure the American AI supply chain.