Industry Trends & Technologies News & Articles

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Altera Guarantees Support for Key FPGA Families Through 2045

Extended lifecycle support for Agilex, MAX 10, and Cyclone V families aims to provide decades of stability for mission-critical applications.

Apr 12, 2026
Microchip Technology Achieves IEC 62443-4-1 Certification for Secure Industrial Development

New independently verified cybersecurity certification strengthens supply chain trust and accelerates readiness for the EU Cyber Resilience Act.

Apr 10, 2026
ADLINK Integrates Intel Core Ultra Series 3 into New COM Express Modules for Edge AI

New hardware architecture delivers up to 180 platform TOPS and extended temperature support for mission-critical robotics and industrial automation.

Jan 23, 2026
congatec Integrates AMD Ryzen AI P100 Processors into New Rugged COM Express Modules

A new series of Type 6 Compact modules delivers up to 59 TOPS of AI performance for mission-critical edge applications in harsh industrial environments.

Jan 20, 2026
ThunderSoft Debuts AI-Native Operating System Architecture Across Automotive and Robotics Sectors

New AIOS platform integrates system-level artificial intelligence to bridge the gap between digital models and physical hardware execution.

Jan 12, 2026
TDK Advances Wearable Intelligence with Edge-Processing Motion Sensors

New SmartMotion IMUs offload computational tasks from the central processor to the sensor, enabling high-fidelity spatial audio and AR overlays with ultra-low power consumption.

Jan 07, 2026
NXP Launches S32N7 Processor Series to Centralize Core Vehicle Functions

New 5 nm super-integration processors enable OEMs to consolidate propulsion, safety, and body domains into a single hub, reducing architecture complexity and costs.

Jan 05, 2026
High-Performance Edge Platform Debuts to Accelerate AI-Driven Clinical Diagnostics

Axiomtek introduces a medical-grade computing system featuring 13th Gen Intel Core processing and dedicated GPU expansion for real-time imaging and surgical monitoring.

Jan 04, 2026
Infineon and Lenovo Partner to Drive Autonomous Capabilities in Software-Defined Vehicles

New high-performance computing platforms leverage AURIX microcontrollers to scale AI integration from partial to high automation levels.

Jan 04, 2026
Renesas Launches 3nm Multi-Domain SoC and RoX Whitebox SDK to Streamline SDV Development

New R-Car X5H silicon samples and a production-grade development platform aim to unify ADAS, infotainment, and gateway functions on a single 3nm automotive compute engine.

Jan 02, 2026
VIA Labs Enters Industrial Market with High-Reliability USB 2.0 Hub Controllers

New VL122 and VL123 controllers offer extended temperature support and enhanced signal integrity for demanding embedded and industrial environments.

Dec 20, 2025
Cadence Achieves 64Gbps Tapeout for Third-Generation UCIe IP on TSMC N3P Process

New high-bandwidth chiplet interconnect reaches 64G speeds to meet the escalating performance and power demands of AI and data center architectures.

Dec 19, 2025
High-Performance RISC-V Toolchain Support Expands for Next-Generation Automotive Safety Systems

IAR and SiFive deepen their collaboration to provide certified development tools for the latest 32-bit and 64-bit automotive-grade RISC-V processor cores.

Dec 17, 2025
GigaDevice Introduces Dual-Voltage xSPI NOR Flash to Reduce Power in High-Speed SoC Designs

The new GD25NX series leverages a 1.2 V I/O architecture to slash read power consumption by half while delivering data throughput of up to 400 MB/s.

Dec 03, 2025
Defending the Edge: Kaspersky Boosts Behavioral Protection for Embedded Infrastructure

New KESS update brings advanced anti-ransomware and BadUSB prevention to low-power and legacy devices.

Nov 28, 2025
Kontron and congatec Integrate Secure OS to Streamline IEC 62443 Compliance

A new partnership brings KontronOS to congatec’s aReady.COM portfolio, offering developers a hardened, Linux-based foundation for cyber-resilient embedded systems.

Nov 27, 2025
Littelfuse Increases Power Density with High-Current 200 V Ultra-Junction MOSFET

New X4-Class device delivers 480 A capability in a compact SMPD-X package to streamline thermal design and reduce component count in industrial and energy applications.

Nov 27, 2025
OpenAI and Foxconn Partner to Develop Next-Generation AI Infrastructure in the United States

A new strategic collaboration focuses on co-designing high-performance data center hardware and domestic manufacturing to secure the American AI supply chain.

Nov 22, 2025
Xen Project Modernizes Hypervisor with 4.21 Release for Automotive and Embedded Systems

The latest update introduces RISC-V groundwork, enhanced functional safety compliance, and improved performance scaling for next-generation hardware.

Nov 20, 2025