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Successful testing enables the use of cost-effective, high-bandwidth HYPERRAM with the AMD MicroBlaze V processor for embedded AI and I/O expansion applications.

The update introduces solutions for real-time human fall detection, energy-efficient object recognition, and automated land-cover change analysis across diverse embedded platforms.

EMASS's ECS-DoT AI chips integrate with Semtech's LoRa transceivers to provide long-range, battery-efficient intelligence for IoT systems requiring on-device data processing.

Joint research demonstrates a path toward high-performance, cost-effective, and fully integrated radio frequency and optical front-end modules using layered silicon technologies.

Siemens and nVent collaborate on a Tier III-capable reference architecture that combines industrial electrical systems with advanced liquid cooling to accelerate AI infrastructure deployment and efficiency.

The new GD25NX series leverages a 1.2 V I/O architecture to slash read power consumption by half while delivering data throughput of up to 400 MB/s.

New KESS update brings advanced anti-ransomware and BadUSB prevention to low-power and legacy devices.

A new partnership brings KontronOS to congatec’s aReady.COM portfolio, offering developers a hardened, Linux-based foundation for cyber-resilient embedded systems.

New X4-Class device delivers 480 A capability in a compact SMPD-X package to streamline thermal design and reduce component count in industrial and energy applications.

New secure NFC tag enables seamless "tap-to-pair" device commissioning and battery-less setup for the latest Matter 1.5 standard.

A new strategic collaboration focuses on co-designing high-performance data center hardware and domestic manufacturing to secure the American AI supply chain.

The latest update introduces RISC-V groundwork, enhanced functional safety compliance, and improved performance scaling for next-generation hardware.

As one of the first Canadian firms to reach this milestone, WOLF aligns with rigorous U.S. Department of Defense standards for protecting sensitive mission data.

New sixth-generation RCD achieves a 10% bandwidth increase to meet the rigorous memory demands of generative AI and high-performance computing.

New 280 MHz microcontrollers combine advanced security, flexible memory allocation, and industrial-grade reliability for demanding automation and robotics applications.

A new series of expansion cards brings reliable Ethernet, Serial, and CAN Bus capabilities to embedded systems operating in extreme environments.

New SOSA-aligned modules leverage NVIDIA Blackwell architecture to deliver data-center-class processing power to aerospace and defense environments.

LCR Embedded Systems introduces a VITA 46.11 compliant manager designed to simplify in-field debugging and enhance reliability in rugged defense architectures.

A new collaborative lab combines GD32 MCU expertise with Gallium Nitride technology to push the boundaries of power density in AI data centers and renewable energy.