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Siemens and nVent collaborate on a Tier III-capable reference architecture that combines industrial electrical systems with advanced liquid cooling to accelerate AI infrastructure deployment and efficiency.

The new GD25NX series leverages a 1.2 V I/O architecture to slash read power consumption by half while delivering data throughput of up to 400 MB/s.

New KESS update brings advanced anti-ransomware and BadUSB prevention to low-power and legacy devices.

A new partnership brings KontronOS to congatec’s aReady.COM portfolio, offering developers a hardened, Linux-based foundation for cyber-resilient embedded systems.

New X4-Class device delivers 480 A capability in a compact SMPD-X package to streamline thermal design and reduce component count in industrial and energy applications.

New secure NFC tag enables seamless "tap-to-pair" device commissioning and battery-less setup for the latest Matter 1.5 standard.

A new strategic collaboration focuses on co-designing high-performance data center hardware and domestic manufacturing to secure the American AI supply chain.

The latest update introduces RISC-V groundwork, enhanced functional safety compliance, and improved performance scaling for next-generation hardware.

As one of the first Canadian firms to reach this milestone, WOLF aligns with rigorous U.S. Department of Defense standards for protecting sensitive mission data.

New sixth-generation RCD achieves a 10% bandwidth increase to meet the rigorous memory demands of generative AI and high-performance computing.

New 280 MHz microcontrollers combine advanced security, flexible memory allocation, and industrial-grade reliability for demanding automation and robotics applications.

A new series of expansion cards brings reliable Ethernet, Serial, and CAN Bus capabilities to embedded systems operating in extreme environments.

New SOSA-aligned modules leverage NVIDIA Blackwell architecture to deliver data-center-class processing power to aerospace and defense environments.

LCR Embedded Systems introduces a VITA 46.11 compliant manager designed to simplify in-field debugging and enhance reliability in rugged defense architectures.

A new collaborative lab combines GD32 MCU expertise with Gallium Nitride technology to push the boundaries of power density in AI data centers and renewable energy.

A new centralized platform leverages high-performance deterministic processing to collapse 20 electronic control units into just three centralized controllers for software-defined vehicles.

New 3U and 6U modules harness NVIDIA Blackwell architecture to deliver massive gains in AI inference and memory bandwidth for harsh environments.

Updated interface specifications and physical layer protocols set the stage for next-generation UHD mobile displays and high-performance imaging.

Global tablet processor shipments are projected to exceed 400 million units by 2016, driven by a surge in entry-level demand and aggressive competition from new market entrants.